In November 2016 we headlined a post Artificial Intelligence: What Could Derail NVIDIA? A Lab in Shenzhen; A Basement in Moscow; An Office in Bristol (NVDA).
Bristol?...
Graphcore was the "Office in Bristol".
From IEEE Spectrum:
U.K.-based AI computer company Graphcore made a significant boost to its computers’ performance without changing much of anything about its specialized AI processor cores. The secret was to use TSMC’s wafer-on-wafer 3D integration technology during manufacture to attach a power-delivery chip to Graphcore’s AI processor.
The new combined chip, called Bow, for a district in London, is the first on the market to use wafer-on-wafer bonding, say Graphcore executives. The addition of the power-delivery silicon means Bow can run faster—1.85 gigahertz versus 1.35 GHz—and at lower voltage than its predecessor. That translates to computers that train neural nets up to 40 percent faster with as much as 16 percent less energy compared to its previous generation. Importantly, users get this improvement with no change to their software at all.
“We are entering an era of advanced packaging in which multiple silicon die are going to be assembled together to supplement the performance advantages we can get from increasing progress along an ever-slowing Moore’s Law path,” says Simon Knowles, Graphcore chief technical officer and cofounder. Both Bow and its predecessor the Colossus MK2 were made using the same manufacturing technology, TSMC’s N7....
....MUCH MORE
Previously:August 2021
"NVIDIA and the battle for the future of AI chips"
June 2020
"AI chips in 2020: Nvidia and the challengers"
August 2019
"Inside the UK unicorn that's about to become the Intel of AI"
April 2019
Graphcore CEO Takes A Shot at NVIDIA, Talks His Book, Makes a Good Point (NVDA)
And many more. Use the 'search blog' box upper left, if interested.
