As the kids say: Big if true.
In late October we linked to this story, "China reportedly caught reverse-engineering ASML’s DUV lithography". The efforts, which have been going on for years are a very tough slog.*
The Chinese are trying to recreate the most complex machine ever manufactured by human beings. In the example above, the Chinese engineers broke the ASML machine. Hilarity ensued.
They called ASML to request a service call.
Now it appears they may not have to conquer the next-level Extreme Ultra Violet technology to get to next year's state-of-the-art in chip manufacturing.
The DUV will do.
From the always-alert observers at Huawei Central, December 2:
Huawei may have a 2nm chip breakthrough
Huawei
is pouring efforts to make a breakthrough in the chip industry, and it
looks like the company has plans on this matter based on the 2nm process
technology. A new patent is here showcasing the attempts of the firm
despite lack of high-end tools.
The Chinese OEM recently issued a patent for a 2nm
chip technology. While the company is still facing challenges to catch
its rivals in the chipset battle, it is planning to end this phase,
probably by the end of next year.
But the question is, how is that going to be possible, as Huawei has just hit the 5nm mark this year with the Kirin 9030 chip (N+3 node), powering the Mate 80? Well, the answer lies in the patent. Let’s explore it in full detail.
Patent: 21nm metal pitches
Starting with the application, the company applied for the new patent
with the CN119301758A number on June 8, 2022, and it was published this
year on January 10. It is entitled “Metal Integration Method for
Manufacturing Integrated Devices”.
It is primarily focused on the manufacturing of advanced
semiconductors. Also, it resolves the bottlenecks related to the BEOL
patterning for ICs (Integrated Circuits).
BEOL (Back-End-Of-Line) is a crucial stage in the chipmaking process,
where metal interconnect layers are deposited to connect the individual
transistors and devices developed during the Front-End-Of-Line (FEOL)
procedure.
The process is used to create electrical pathways that form the IC
and allow signals to transmit between components seamlessly. In terms of
21nm or below chips, this process often becomes a problem in resistance
capacitance delay, reliability, and yield.
2nm process
According to a Semiconductor researcher, Dr. Frederick Chen, who spotted the new patent, Huawei can achieve a 2nm process chip, and that too without any advanced EUV machine. This will become possible with the help of DUV equipment.US ban on Huawei in 2019 restricted the company from using the
cutting-edge chip technologies. As a result, the OEM began joining hands
with the native semiconductor firms like SMIC and relied on the DUV
machines for the past few years....
....MUCH MORE
By-the-bye, for the last couple years there have been stories that Huawei has the EUV technology but that is hard to believe. The problem the Chinese face is that to recreate the world's most complex machine they have to recreate ASML's supplier ecosystem.
From TrendForce, November 10:
ASML’s Magic Uncovered: Tech and Partners Behind Its EUV Edge China Can’t Replicate
While China is racing to close the lithography gap with homegrown
tools from Huawei-linked SiCarrier and Yuliangsheng, the reality is that
extreme ultraviolet (EUV) lithography remains an entirely different
universe. Machines capable of printing sub-5nm chips are not just
complex—they’re the pinnacle of global scientific collaboration.
Take ASML, the Dutch firm that holds a virtual monopoly in EUV. With
Intel, TSMC, and Samsung as its main clients, ASML’s dominance isn’t
merely about technological leadership—it’s about an ecosystem that no
country can replicate overnight.
As Focus: The ASML Way reveals, ASML doesn’t exactly build
EUV scanners—it conducts them like a symphony. Instead of crafting the
optics, light source, or other core modules on its own, ASML serves as
the master orchestrator, coordinating a global network of over 100
top-tier suppliers.
Let’s take a closer look inside this technological marvel—unpacking
the structure of ASML’s EUV system, the key enablers behind its core
components, and how this intricate collaboration has become the driving
force behind ASML’s dominance.
From Light to Chip: Inside ASML’s EUV Process
As ASML
explains, its EUV lithography is like carving circuits with a
“nanoscale light scalpel.” Imagine trying to etch an entire encyclopedia
onto a single grain of rice—ASML’s EUV machines do something similar:
they use extremely short-wavelength light to “print” microscopic circuit
patterns onto silicon wafers.
First, the system needs a light source. In the case
of EUV, it uses a special 13.5 nm wavelength light—5,000 times thinner
than a human hair. This incredibly short wavelength is what enables
printing such microscopic patterns. But keep in mind that the entire
process must occur in a vacuum because this type of
light gets absorbed by air instantly. Without a vacuum, the precious EUV
light would disappear before reaching the wafer.
Next, ultra-precise reflective mirrors are required
to capture, focus, and guide the light through the system—like using a
magnifying glass to focus sunlight, but with precision millions of times
greater. These mirrors are polished to atomic-level smoothness to
ensure no light is lost.
The light is then shaped and shines through a “stencil” called a photomask,
which contains the chip’s circuit design. The light projects this
pattern onto a silicon wafer, almost like shining a flashlight through a
paper cutout to leave a tiny, precise shadow on the surface.
Notably, one critical advantage ASML has is its High-NA EUV technology, which uses anamorphic optics
to compress patterns 4x in one direction and 8x in the other—like a
smart shrinking lens. This allows a single exposure to create extremely
fine features.
In contrast, DUV lithography systems (currently the most advanced
technology accessible to Chinese manufacturers) must use
multi-patterning—stamping the same area multiple times—to approach
similar resolution, making the process slower, more expensive, and more
prone to defects.
Team Effort Behind ASML: Key Component Suppliers
Twenty years. That’s how long it took ASML
and its partners to perfect EUV lithography technology, according to
the company. The payoff? A machine so complex it contains roughly
100,000 parts working in perfect harmony, and shipping a single unit is
like orchestrating a small military operation—40 freight containers,
three cargo planes, and 20 trucks, all coordinated just to get one
machine from factory to fab.
And the price tag? The latest High-NA EUV machine commands over $350
million—more expensive than a private jet, yet essential for
manufacturing the world’s most advanced chips. To achieve such a feat,
ASML teams up with specialized suppliers, each mastering their part, to
build a machine that pushes the limits of chip-making.....
....MUCH MORE
Which is why it is such a big deal if Huawei can get to similar specifications without having to develop the bleeding edge technology. Even TSMC finds the High-NA EUV to be a bit daunting, cost/performance-wise:
TSMC Is Reportedly Skipping High-NA EUV For The A14 (1.4nm) Process; Prioritizing Cost-Efficiency Over Performance