From EE Times, May 27:
At its 2025 Europe Technology Symposium in Amsterdam, The Netherlands, TSMC announced that it is establishing a European design center in Munich, scheduled to open in Q3 2025 in order to support its European customers.
The company said that this will be its tenth design center, joining a network of design centers across Taiwan, the U.S., Canada, mainland China and Japan. TSMC said it chose Munich rather than Dresden—the latter is where it is building a fab for the N16 and N28 families—because Munich is close to its European customers.
According to the media briefing held today, the European Design Center will facilitate optimized chip designs for emerging applications in automotive, industrial applications, AI, telecommunications, IoT and beyond, as well as cultivate and expand expertise in automotive and non-volatile memory across the EU, focusing on advancing rapidly growing RRAM and MRAM innovations while supporting the industry to move beyond eFlash technology.
Technology roadmap plus N2/N3 tape-outs
From a technology roadmap viewpoint, the European event reiterated the developments in process technologies and packaging that it presented at the North American counterpart event in California last month (see TSMC Announces World-Leading A14 Node to Power AI), providing updates on A14, A16, N2, N3, as well as its 3D silicon stacking and advanced packaging. It also noted factors like integrated power delivery to improve power delivery density....
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